At OFC 2025, SiFotonics launched a high-response (0.75A/W), back-illuminated Ge/Si 200Gbps/lane photodetector (PD) chip, including both single-channel and four-channel array versions. The product is designed for 1.6T DR8 and 2xFR4 high-speed optical module applications. Developed and manufactured using SiFotonics' proprietary "IDM-Lite" silicon photonics production line, the chip features a back-illuminated, Flip Chip design, with a microlens integrated on the backside of the silicon substrate for the first time. This design achieves an effective photosensitive area of 34μm, offers a bandwidth of over 52GHz, and provides an O-band responsivity of 0.75A/W. The chip is compatible with mainstream transimpedance amplifiers (TIAs) and is available in two versions: one with solder for Flip Chip-to-TIA applications and another with solder bumps for Flip Chip-to-substrate applications.

About SiFotonics
Founded in 2007, SiFotonics Technologies (also known as CIPhotonics) is one of the world's earliest original technology and productization companies in silicon photonics. It is now a leading global provider of silicon photonic devices and integrated chip solutions. SiFotonics operates a unique "IDM-Lite" silicon photonics process line and advanced germanium-silicon epitaxial growth technology. With over 17 years of experience in silicon photonic device and chip design and mass production, the company holds more than 100 global patent authorizations and has achieved industry leadership in silicon photonic chip technology platforms, shipment volumes, and market share. SiFotonics continues to focus on delivering highly competitive silicon photonic devices, integrated chips, and solutions for markets such as AI clusters, data centers, coherent communications, 5G/6G wireless networks, next-generation PON, LiDAR, and optical sensing. The company leverages its disruptive silicon photonics technology to accelerate global AI intelligence and digital transformation.