Molex Showcases Fully Integrated Wavelength Management Solutions at OFC 2019
Intelligent optical solutions for data centers, 5G and high bandwidth networks
LISLE, IL – March 6, 2019 – Molex will highlight its next-generation wavelength management subsystems and optical disaggregated box solutions for dynamic high-bandwidth telecommunications and network infrastructure at the Optical Fiber Communications Conference (OFC), March 5-7, 2019 at the San Diego (CA) Convention Center in booth 2807.
The accelerating growth of hyper-scale data centers and the upcoming 5G wireless deployments demand flexible and scalable optical transport solutions with a compact footprint for fast deployment and efficient operation. Molex Optical Solutions’ comprehensive product portfolio enables its customer base of optical system vendors to deliver intelligent high bandwidth solutions to web-scale customers, wireline and wireless carriers.
Molex will demonstrate key technologies that provide the building blocks for next-generation architectures that demand a disaggregated approach. Included in this product suite are:
Bernoulli, a compact form-factor multi-faceted module that can perform functions of wavelength selective switching (WSS), power monitoring and dynamic spectral control
Dirac, the latest offering of high-port-count WSS for route-and-select architectures that demand 32+ ports
C+L Band EDFA and Raman Amplifiers, which incorporate compact low-loss spectral control elements to enhance optical engineering rules
In addition, Molex will showcase the MxN Broadband Optical Switch PXC family of products addressing transparent optical switching requirements in a variety of applications ranging from broadcasting, data centers, and service provisioning to lab automation and sensor monitoring. Also available for viewing are Molex’s grey box solutions, chassis subsystem platforms with SDN and CLI management capabilities, address customer requirements in DCI, 5G and high bandwidth applications by vertically integrating its optical components and modules through original design manufacturing (ODM) and original brand manufacturing (OBM) processes.
For more information, please visit Molex booth #2807 at OFC 2019 or https://www.connector.com/solutions/ofc to explore a robust portfolio of next-generation, high-speed, high-density optical solutions.
