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Home > NEWS > Chengdu InSiGa to showcase industry’s first 50Gbs uncooled i-temp active TOSA at CIOE 2021

Chengdu InSiGa to showcase industry’s first 50Gbs uncooled i-temp active TOSA at CIOE 2021

2021-09-17    Lynn

Chengdu InSiGa Semiconductor Technologies announced that it will have a live demo of its industry-leading 50Gbs DML based uncooled i-temp active TOSA at booth 6A21 during CIOE, 2021.


5G Networks already deploy DML based TOSA’s for 50G Mid-haul applications. The need for 50G i-temp TOSA’s for 5G Fronthaul applications has stringent requirements on performance and power dissipation. Using InSiGa’s patented DML driver technology, InSiGa has developed an ultra-low power TOSA for 50G Front-haul application. The uncooled TOSA has a typical power dissipation of 200mW using commercially available lasers. This power dissipation is less than half the power dissipation achieved by other commercial solutions used in C-temp applications. The TO-60 form-factor TOSA can operate from -40C to 85C meeting the OMA and TDECQ requirements for 50Gbs transceiver modules. This TOSA is an ideal solution for SFP56 form-factor modules that will be used in 5G front-haul applications. With this new product, InSiGa adds to its portfolio of active 50G C-temp and cooled i-temp TOSA’s already shipping to customers.



Please visit us at booth CIOE 6A21 during CIOE, 2021. We will be happy to discuss more about this TOSA solution and your requirements.


About InSiGa Semiconductor Technologies


InSiGa Semiconductor Technologies Co., Ltd. was established in 2016, focusing on the development and production of 25G~800G optical communication Driver, CDR, TIA and OSA products. InSiGa has already developed a series of 25G/50G/100G /200G/400G/800G high-speed optical communication chips and optical component products, and accumulated a number of patents along the way. 5G mid-haul/back-haul products and 200G products using InSiGa chips are already in the mass production and delivery stage. With the mission of meeting customer needs, InSiGa will continue to innovate, develop more high-speed IC and OSA products, provide customers with first-class products, technologies and related services, and support the rapid development of the 5G and data center optical transmission market.