Carlsbad, CA – June 30, 2022 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced the consignment of an SST 5100 Vacuum Reflow Furnace at the Electronics and Photonics Innovation Centre (EPIC) in Paignton, UK. The focus will be on delivering higher-quality optoelectronics packaging for several different applications.
EPIC is a center of excellence, supporting technological innovation and promoting collaborative activity between businesses and research institutions. It focuses on supporting start-up and spin-off companies and encourages foreign direct investment to Torbay and its microelectronics and photonics sector. Previously, Palomar has placed a Palomar 3880 Die Bonder and 8000 Wire Bonder, at the EPIC Prototyping Suite, which were subsequently purchased and are now available for use by EPIC members and other photonics companies to use on photonics/optoelectronics projects.
For the manufacture of optical transceiver engines, using the void-free solutions delivered by the SST 5100 can deliver higher thermal conductivity, thinner bond lines and a cleaner finish. This requires changing from epoxy bonding of a TEC to gold box bond, as well as for the CoC to TEC bond, to a eutectic sandwich bond process achieved with a vacuum reflow furnace.
For higher bit rate transceivers (over 400G to 1.6T), supplementing ball bumping from the Palomar 8000/8100 Ball Bonder and flip-chip thermo compression bond on the Palomar 3880/3880-II Die Bonder with the over-pressure advantage provided by the SST 5100, is expected to provide the superior RF performance needed for market success.
Companies interested in learning more about the void-free, vacuum reflow capabilities of the SST 5100 or utilizing any of the equipment in the EPIC Prototyping Suite should contact EPIC directly.
About Palomar Technologies
Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved quality and yield, reduced assembly times, and rapid ROI.
With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.
Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore, and China. For more information, visit: http://www.palomartechnologies.com
