Amid the rapid development of AI cluster applications, optical modules deployed in data centers will gradually upgrade to 1.6 Tbit/s in the future. According to the market research firm LightCounting, the application of AI clusters has undergone rapid growth since 2024. It is estimated that by 2028, 38% of all optical modules will be used in AI intelligent computing scenarios. 1.6T optical modules are expected to go into commercial use in 2027, after which their market share will see a gradual increase. As such, 1.6T optical module standards and industry upgrade are major topics of focus in the industry.
In July 2024, the PMD working group of International Photonics & Electronics Committee (IPEC) Technical Committee initiated the 1.6T optical module standards project. The project covers different transmission distances, such as 1.6T 100 m, 500 m, and 2 km, and involves various solutions such as multi-mode VCSEL, EML, and SiP. The optical module specifications for GEN1 scenarios (200G/lane) are expected to be released by the end of 2025, and those for GEN2 scenarios (400G/lane) by the end of 2027.
At CIOE held in Shenzhen World Exhibition & Convention Center from September 11 to 14, with 1.6T high-speed interconnection as the theme, IPEC worked with multiple IPEC members to demonstrate optical modules and related chips. The aim is to further drive the advancement of the 1.6T optical module industry chain and promote the technical exchanges of 1.6T optical modules in the industry. The IPEC booth is at 12-A71 of Hall 12.
In the 1.6T high-speed interconnection exhibition, 1.6T optical module vendors like Huawei HiSilicon, Source Photonics, HG Genuine, Hisense Broadband, Accelink, and other industry-leading optical module companies demonstrated products spanning from 1.6T OSFP DR8 to 1.6T OSFP 2 × DR4 and 1.6T OSFP 2 × FR4. Industry-leading high-speed optoelectronic chip companies like Huawei HiSilicon, Source Photonics, Semtech, SiFotonics, InSiGa, Turing Quantum, and Sicoya showcased more than 10 types of 1.6T optoelectronic chips, such as 224 Gbit/s VCSEL/ EML/SiP/DRV/TIA, and TFLN.
IPEC expects to provide an open technical exchange platform for the industry to fully demonstrate mature 1.6T optical modules and chip solutions. It aims to lead the industry to carry out extensive knowledge sharing of 1.6T high-speed interconnection technologies, accelerate collaborative innovation of technologies, and contribute to 1.6T standards formulation. This will further promote the diversified, complementary, and sustainable development of the industry chain, paving the way for the application and promotion of 1.6T high-speed interconnection technologies in AI clusters. Industry experts are welcome to visit the booth and share ideas on the 1.6T high-speed interconnection technologies.
About IPEC
IPEC (www.ipec-std.org) is an international standards organization that is committed to developing open optoelectronic standards and delivering strategic roadmap reports. IPEC focuses on standardizing solutions in optical chips, optical/electrical components, and optical modules. Markets addressed by IPEC include 5G, IoT and AI.
Registered in Switzerland, IPEC is open to any interested party who wishes to join. All IPEC members have the opportunity to participate in the formulation of all IPEC standards in a fair and transparent manner.
