Exhibition
Feast for Optical Module Enterprises: 3.2T Optical Engine Layout & Widespread Rumors of OCS Orders
The 26th China International Optoelectronic Expo (CIOE) has concluded, and this year’s edition saw record-breaking att......
General
Sunyu Photonics Breaks Through PIC Mass Production Bottleneck: Wafer-Level Edge-Coupling Test Platform Based on Polished FAU Probes
Wafer-level testing of Photonics Integrated Circuits (PICs) is a complex interdisciplinary systems engineering discipline, integrating precision machinery, optical design, automatic control, and software algorithms. Sunyu Photonics’ solution directly addresses the core pain points of PIC wafer testing. Through integrated innovation of optoelectronics, software, and machinery, it has successfully resolved industrialization challenges of edge-coupling technology in terms of precision, efficiency, and reliability. This provides critical testing support for large-scale PIC mass production and is expected to accelerate the development of the entire photonics integration industry.
Market Insights
The Battle Over Scale-Up at the OCP Taipei Summit: Who Is the
LightCounting stated that one of the most noteworthy panel discussions at the Taipei conference revolved around "scale-up networking." Key participants in this discussion included Kurtis Bowman (Chairman of the UALink Alliance Board of Directors and Director of Architecture and Strategy at AMD) and Ram Velaga (Senior Vice President of Broadcom and General Manager of the Core Switch Business Group).
