Welcome to CFCF 2026——Asia’s top optical connectivity event
Connected Fiber Connects Future
Connected Fiber Connects Fortune
Date: June 25-27, 2026
Location: Longzhimeng Grand Hotel, Suzhou, China
Organizers: China Fiber Optics online, Jiangsu Institute of Communications, Cordacord Industry Research Center
Theme: Optics Connects Everything, Creates Multifaceted Future
Scale: 6000+ professional attendees, 160+ exhibiting companies
As one of Asia’s most influential optical connectivity event, CFCF 2026 is dedicated to addressing industry pain points and opportunities, connecting the whole fiber optics ecosystem, promoting all exhibitors’ business and providing all attendees better understanding towards our industry.
The explosive growth of data throughput from AI large model has created unprecedented demands for optical connectivity. The industry now faces diversified technological development paths—from traditional pluggable transceivers to novel approaches like OIO, CPO/CPC. Advancements in advanced package, photonic integrated circuit, modulation formats and new materials are pushing single-channel rates higher, with a core pursuit of high density, and low power consumption .
On the other hand, the whole industry is facing huge shortage of manufacturing capability, key component supply, even talented engineers. Under the pressure of their customers, industry players have to put huge investment into their production line.What entrepreneurs face not only are technology hurdles but also management puzzles.
Our industry is in one of the hottest economic period in the history. What we can do and what we should do in this market. CFCF2026 will give you the answer. The event is structured around below key points that address the most pressing questions in the AI-driven optical interconnect landscape:
1. The Path for Chinese Computing Power Breakthrough:
Experts from leading domestic GPU manufacturers and LLM developers will share their progress and, crucially, their perspectives on critical issues like "hyper-node interconnection" for domestic AI clusters.
2. Corporate Strategy in Current Situation:
Industry gurus and consultants will present their observation and solution towards current market situation from their experience.
3. Solution on AI's Three Core Interconnect Scenarios:
The entire event's discussions and exhibitions are precisely anchored to the three fundamental AI computing interconnect needs: Scale-up (Vertical Scaling), Scale-out (Horizontal Scaling), and Scale-across (Cross-Domain Interconnection).
4. From Pluggable Transceiver to CPO/OIO:
In response to the current coexistence of multiple interconnect architectures (CPO, NPO, LPO), leading technology vendors will be invited to discuss the technical challenges, latest advancements, opportunities, and future trends of each path, helping the industry navigate this complex landscape.
5. Heterogeneous Integration and PICs
This session will cover optical chip technologies, including EML, VCSEL, CW, Silicon Photonics (SiPh), Thin-Film Lithium Niobate (TFLN), etc.
6. HCF/MCF and other Special Fiber:
How novel fibers like Multi-Core Fiber (MCF) and Hollow-Core Fiber (HCF) will change our industry.
7. Special Topics on High Speed Transceiver Manufacturing
800G/1.6T and higher data rate transceivers are the focus of today’s fiber optics industry. In this session, invited speakers will discuss below key problems
7.1 FAU Auto manufacturing
7.2 Domestic DSP breakthrough
7.3 Thermal management
7.4 How auto-manufacturing support made in America
7.5 Metalens and other coupling technology
8.Who can competite with MEMS OCS ?
Silicon Photonics, PCM and other switch solution，opportunites and challenges
9. 448Gbps Electrical Connection:
Experts from the Shenzhen connector industry association will discuss new advancements on 448Gbps electrical connector.
10. Release of Forward-Looking Industry Roadmap:
A key report, the "2026-2030 Technology and Market Demand Elasticity Report," from IPEC will be released live, providing clear guidance for future technology and strategic planning.
Three-Day Agenda at a Glance
Day 1: Future & Innovation
Young Student Thesis Competition
Tutorial Workshops (Low speed transceivers, Glue process, Grinding process etc. )
Innovation Product Launch sessions, where companies present their annual breakthrough solutions.
Day 2: Technology & Application
Plenary Session
Exhibitions
Technology Panel Discussions
Day 3: Deep Dive & Future Outlook
Parallel Sessions: Five parallel tracks focusing on High-Speed Pluggables, Data Center Innovation, Photonic Integration, OIO Applications, and T-bit Era Deployment.
Future Roadmap: The official release and presentation of the 2026-2030 Industry Roadmap Report.
Sponsorship
CFCF2026 offers diverse branding and partnership opportunities, including but not limited to: Exhibition Booths, Various Advertisement & Event Sponsorships (Outdoor Ads, Conference Guide, Banquet, etc.), and Workshop Sponsorships. For inquiries, please contact the organizing committee .
Conclusion
CFCF 2026 is not merely an exhibition platform but a thought leadership hub and industry bellwether. It is designed to tackle the most critical and cutting-edge challenges in the AI computing era through full-industry-chain dialogue, deep technical debates, a focus on domestic computing demands, and authoritative future trend analysis.CFCF2026 welcomes you.
