Connected Fiber Connects Future
Connected Fiber Connects Fortune
Date: June 25-27, 2026
Location: Longzhimeng Grand Hotel, Suzhou, China
Organizers: China Fiber Optics Online, Jiangsu Institute of Communications, Cordacord Industry Research Center
Theme: Optics Connects Everything, Creates Multifaceted Future
Scale: 6000+ professional attendees, 160+ exhibiting companies
As one of Asia’s most influential optical connectivity events, CFCF 2026 is dedicated to addressing industry pain points and opportunities, connecting the entire fiber optics ecosystem, boosting business for all exhibitors, and providing all attendees with a better understanding of the industry.
The explosive growth of data throughput driven by large AI models has created unprecedented demand for optical connectivity. The industry now faces diversified technological development paths—from traditional pluggable transceivers to novel approaches like OIO, CPO/CPC. Advancements in advanced packaging, photonic integrated circuits, modulation formats, and new materials are pushing single-channel rates higher, with a core focus on high density and low power consumption.
On the other hand, the entire industry is facing severe shortages in manufacturing capacity, key component supply, and even skilled engineering talent. Under pressure from customers, industry players are making massive investments in expanding their production lines. Entrepreneurs today face not only technological challenges, but also complex management issues.
The optical connectivity industry is currently experiencing one of the most dynamic growth periods in its history. What strategies should companies adopt in this rapidly changing market landscape? CFCF 2026 will give you the answer. The event is structured around the following key points that address the most pressing questions in the AI-driven optical interconnect landscape:
1. The Path for Chinese Computing Power Breakthrough
Experts from leading domestic GPU manufacturers and LLM developers will share their progress and, crucially, their perspectives on critical issues like "hyper-node interconnection" for domestic AI clusters.
2. Corporate Strategy in Current Situation
Industry leaders and consultants will share their observations and solutions to the current market situation based on their extensive experience.
3. Solutions to AI's Three Core Interconnect Scenarios
The entire event's discussions and exhibitions are precisely anchored to the three fundamental AI computing interconnect needs: Scale-up (Vertical Scaling), Scale-out (Horizontal Scaling), and Scale-across (Cross-Domain Interconnection).
4. From Pluggable Transceivers to CPO/OIO
In response to the current coexistence of multiple interconnect architectures (CPO, NPO, LPO), leading technology vendors will be invited to discuss the technical challenges, latest advancements, opportunities, and future trends of each path, helping the industry navigate this complex landscape.
5. Heterogeneous Integration and PICs
This session will cover optical chip technologies, including EML, VCSEL, CW, Silicon Photonics (SiPh), and Thin-Film Lithium Niobate (TFLN).
6. HCF, MCF and Other Special Fibers
How novel fibers such as Multi-Core Fiber (MCF) and Hollow-Core Fiber (HCF) will transform the industry.
7. Special Topics on High-Speed Transceiver Manufacturing
800G and 1.6T and higher data rate transceivers are the focus of today’s fiber optics industry. In this session, invited speakers will discuss the following key issues:
￮ 7.1 Automated FAU Manufacturing
￮ 7.2 Domestic DSP Breakthroughs
￮ 7.3 Thermal Management
￮ 7.4 How Automated Manufacturing Supports “Made in America”
￮ 7.5 Metalens and Other Coupling Technologies
8. Who Can Compete with MEMS OCS?
Silicon Photonics, PCM and other switching solutions: opportunities and challenges
9. 448 Gbps Electrical Connection
Experts from the Shenzhen Connector Industry Association will discuss new advancements in 448 Gbps electrical connectors.
10. Release of Forward-Looking Industry Roadmap
A key report, the "2026-2030 Technology and Market Demand Elasticity Report," from IPEC will be released live, providing clear guidance for future technology and strategic planning.
Three-Day Agenda at a Glance
• Day 1: Future & Innovation
Young Student Thesis Competition
Tutorial Workshops (Low-Speed Transceivers, Glue Processing and Grinding Technologies)
Innovation Product Launch Sessions, where companies showcase their annual breakthrough solutions.
• Day 2: Technology & Application
Plenary Session
Exhibitions
Technology Panel Discussions
• Day 3: Deep Dive & Future Outlook
Parallel Sessions: Five parallel tracks focusing on High-Speed Pluggables, Data Center Innovation, Photonic Integration, OIO Applications, and T-bit Era Deployment.
Future Roadmap: The official release and presentation of the 2026-2030 Industry Roadmap Report.
Sponsorship
CFCF 2026 offers diverse branding and partnership opportunities, including but not limited to: Exhibition Booths, Various Advertisement & Event Sponsorships (Outdoor Ads, Conference Guide, Banquet), and Workshop Sponsorships. For inquiries, please contact the organizing committee.
Conclusion
CFCF 2026 brings together global industry leaders to explore the future of AI-driven optical connectivity. It is designed to tackle the most critical and cutting-edge challenges in the AI computing era through full-industry-chain dialogue, in-depth technical debates, a focus on domestic computing demands, and authoritative future trend analysis. CFCF 2026 welcomes you.
